| 摘要 |
The purpose of the present invention is to perform edge trimming to a peripheral portion of a wafer by a simple method. A wafer processing method of the present invention includes a tape attaching step of attaching a surface protecting tape (10) via an adhesive layer (11) in only a peripheral marginal area (6), and a cutting step of cutting a peripheral portion of a wafer (1) using a rotating cutting blade (13) to form a peripheral cut portion having a predetermined width and a predetermined depth. Accordingly, edge trimming of the peripheral portion (7) can be easily performed without adhering particles generated in cutting the wafer to a device area (5). In addition, the volume of a portion to be cut by a cutting blade (13) is reduced as compared with the case that the edge trimming is performed while a support substrate is attached to the wafer (1), so a cutting speed of the cutting blade (13) can be increased to obtain a higher processing quality. Furthermore, after cutting, no adhesive layer remains in the device area (5) of the wafer (1), so the need for cleaning the device area (5) can be eliminated. |
