| 摘要 |
PURPOSE:To achieve a higher efficiency of grinding along with a higher dimensional accuracy of a work by finishing a plurality of wafers with several carriers simultaneously. CONSTITUTION:When grinding wafers 20, they are each arranged in a recess 16 of a carrier 13. With the wafers 20 held between an upper disc 14 and a lower disc 15, an inner gear 12 is turned. The carrier thus keeping the wafers is rolling by itself while turning betweeen an outer gear 11 and the inner gear 12. The surface of the wafers is even ground with a grinding agent being injected through a hole 19. This can finish a number of wafers 20 simultaneously to a thickness with a desired dimensional accuracy. |
