发明名称 POLYIMIDE RESIN, RESIN COMPOSITION, AND ADHESIVE SHEET
摘要 PROBLEM TO BE SOLVED: To provide a liquid polyimide resin excellent in processability and heat resistance.SOLUTION: A polyimide resin which is liquid at 25°C and has a maleimide group is obtained by reacting (A) a diamine represented by general formula (1), (B) a diamine represented by general formula (2) (except a diamine corresponding to (A) component) and (C) a polyamic acid obtained by reacting a tetracarboxylic acid dianhydride with (D) at least one selected from the group consisting of maleic anhydride and maleic anhydride derivatives. In the formula (1), n represents an integer of 1 to 70. In the formula (2), Rrepresents a divalent group.SELECTED DRAWING: None
申请公布号 JP2016132735(A) 申请公布日期 2016.07.25
申请号 JP20150008828 申请日期 2015.01.20
申请人 HITACHI CHEMICAL CO LTD 发明人 SATO KITARU;MASUDA KATSUYUKI;SHINADA EIITSU
分类号 C08G73/10;C09J7/02;C09J179/08 主分类号 C08G73/10
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