发明名称 MOLDING PHENOLIC RESIN COMPOSITION
摘要 <p>PURPOSE:To obtain the titled composition having improved flexibility, cracking resistance and heat aging resistance, by adding a specific acrylic polymer to a phenolic resin, and removing the solvent and water under heating. CONSTITUTION:An acrylic polymer having a viscosity of 0.9cps or higher and lower than 3cps, preferably 1cp or higher and lower than 2.5cps, in a 5% solution in ethyl acetate at 25 deg.C in a solution, suspension or solid state is added to a phenolic resin, heated at 80-160 deg.C and then melt mixed while removing the solvent and water out of the system. USE:A general molding material, laminating material, etc.</p>
申请公布号 JPS56133354(A) 申请公布日期 1981.10.19
申请号 JP19800036195 申请日期 1980.03.24
申请人 MITSUI TOATSU CHEMICALS 发明人 IMON SHIYUUHEI;TAJIMA YOSHIYUKI;YOKOO TOMOHIDE;EMA KENJI
分类号 C08L33/06;C08L33/00;C08L33/02;C08L61/00;C08L61/04;C08L61/06 主分类号 C08L33/06
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