| 摘要 |
<p>Method of mfg. printed circuits prior to receiving electrical or electronic components comprises punching holes in an insulating base board, covering the board partly with an adherent metal foil, punching through the foil at some of the holes in the base board forming collars, then introducing electrically cnducting material into those holes. Circuits may be etched or otherwise formed in the metal foil prior to punching the holes and forming the collars in the metal foil. Alternatively the circuit etching may be effected after filling the holes. Lead wires of components to be introduced into the circuit can be introduced into suitable holes prior to filling with conducting material. There is no need to solder leads to circuits and thus heat up the circuit with the risk of damaging the metallised portion as in prior art. The substrate can be made from inexpensive plastics material and no thermal shock is applied to it.</p> |
