| 摘要 |
PURPOSE:To make the temperature distribution uniform by forming an uneveness pattern on the back side which corresponds to the distribution of heat on a chip surface. CONSTITUTION:The back side of the surface of semiconductor chip 1 whose more heated part is processed convexly, and the back side of the surface whose less heated parts is processed concavely. Therefore, at the concave parts 5a and 5b, the joint area of chip 1 and the receptacle 2 doesn't contact directly. And, the radiating route from area 4a-4c with more heat is short, while radiating route from area 3a and 3c with less heat is long, so that on the whole uniform distribution of heat is obtained by radiation. |
