发明名称 |
MICRO-SENSOR PACKAGE AND ASSOCIATED METHOD OF ASSEMBLING THE SAME |
摘要 |
A micro-sensor package is provided that includes a micro-sensor and printed circuit board (PCB), or that includes an array of micro-sensors and PCB. The micro-sensor includes a first substrate having opposing front and back surfaces, a sensing element on the front surface of the first substrate, and a through-chip via disposed within the first substrate and electrically connected to the sensing element. The PCB includes a second substrate to which the back surface of the first substrate is bonded. The second substrate defines a recess within which a bond pad is disposed, and the through-chip via of the micro-sensor is electrically connected to the bond pad of the PCB. The micro-sensor package may further include a shim bonded to the PCB, and that may surround an outer boundary of the micro-sensor and have approximately the same thickness as the micro-sensor. |
申请公布号 |
EP2861523(B1) |
申请公布日期 |
2016.08.24 |
申请号 |
EP20130713693 |
申请日期 |
2013.03.18 |
申请人 |
THE BOEING COMPANY;UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INCORPORATED |
发明人 |
UNDERBRINK, JAMES R;SHEPLAK, MARK;ALEXANDER, DYLAN P.;REAGAN, TIFFANY N;MELOY, JESSICA C. |
分类号 |
B81B7/00 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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