发明名称 CONTROLLING DEVICE OF WAFER TEMPERATURE
摘要 PURPOSE:To improve the contact of a work and an electrode and avoid the work from heating up, by making a supporting surface of the work thin, and making the refrigerant pressure inside the electrode a little higher than the pressure inside the dry-etching chamber. CONSTITUTION:After an electrode holder 19 is lowered and the work 13 is placed on the supporting surface 14a, the holder 19 is raised and pressed against a chamber 10 to fix the peripheral part of the work 13 between the work keeper 12. By adjusting the pressure of refrigerant which circulates inside the electrode 14 so that it is a little higher than the pressure inside the chamber 10, the thin supporting surface 14 is pressed against the work 13, thus sufficiently cooling the work 13. This avoids effectively the heating up of the work and also the heat damage of the resist material.
申请公布号 JPS56131930(A) 申请公布日期 1981.10.15
申请号 JP19800033878 申请日期 1980.03.19
申请人 HITACHI LTD 发明人 OOTSUBO TOORU
分类号 H01L21/205;H01J37/34;H01L21/302;H01L21/3065;H01L21/31 主分类号 H01L21/205
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