发明名称 WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a wiring board in which insulation reliability and connection reliability are improved.SOLUTION: A wiring board includes: a core layer comprising a plate-like body and a plurality of liner conductors penetrating the plate-like body in a thickness direction; a wiring layer selectively formed onto a first surface of the plate-like body; and an insulation layer formed onto the first surface and coating the wiring layer, and an interval of the liner conductors apart from a diameter of each of the plurality of liner conductors is small, and the plurality of liner conductors includes a first liner conductor that is disposed to a positioned overlapped with the wiring layer in plane view and conducts to the wiring layer; and a second liner conductor that is disposed to the positioned which is not overlapped with the wiring layer in plane view. An end surface of a first surface side of the first liner conductor is flush with the first surface, the end surface of the first surface side of the second liner conductor is located at a position recessed from the first surface, a vacancy is formed between the end surface of the first surface side of second liner conductor and the first surface, and the vacancy is filled with the insulation layer.SELECTED DRAWING: Figure 1
申请公布号 JP2016162887(A) 申请公布日期 2016.09.05
申请号 JP20150040367 申请日期 2015.03.02
申请人 SHINKO ELECTRIC IND CO LTD 发明人 FUKAZAWA AKIRA
分类号 H01L23/12;H05K1/05;H05K1/11;H05K3/40;H05K3/44;H05K3/46 主分类号 H01L23/12
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