| 摘要 |
The present invention provides a laminated wiring film for an electronic component, and to a sputtering target material for producing a coating layer, wherein the laminated wiring film for an electronic component has a novel coating layer. Closely placing properties, weatherproofing properties, and oxidation resistance are ensured, and wet-etching can be stably performed at high precision. The laminated wiring film comprises a conductive layer consisting of Ag or Ag alloy, and a cover layer for covering at least one surface of the conductive layer. The coating layer contains 1 to 25 atom% of Mn and 4 to 40 atom% of Mo, and contains total 60 or less atom % of the Mn, the Mo, and one or more elements selected from Cu or Fe, and a remaining part of the covering layer is Ni and unavoidable impurities. The coating layer can be produced by using a sputtering target material having a Curie point at room temperature or less. |
