| 发明名称 |
CIRCUIT ELEMENT PACKAGE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING APPARATUS THEREOF |
| 摘要 |
A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer. |
| 申请公布号 |
US2016262292(A1) |
申请公布日期 |
2016.09.08 |
| 申请号 |
US201615061233 |
申请日期 |
2016.03.04 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KUK Keon;KO Young-dae;BEAK O-hyun;HAN Eun-bong;KIM Hyeon-hyang;JUNG Yeon-kyoung;MUN Il-ju |
| 分类号 |
H05K9/00;H05K1/02;H05K3/30;H05K3/10;B05B15/00;H01L23/498;H01L23/31;H01L23/29;H01L21/56;H01L21/3205;H05K1/18;H01L23/552 |
主分类号 |
H05K9/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit element package comprising:
a circuit element disposed on a printed circuit board; an insulating layer covering the circuit element; a first shielding layer covering a side surface of the insulating layer; and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer. |
| 地址 |
Suwon-si KR |
