| 发明名称 |
THERMALLY CONDUCTIVE ADHESIVE |
| 摘要 |
The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and combination of different fillers, as defined herein. |
| 申请公布号 |
WO2016139221(A1) |
申请公布日期 |
2016.09.09 |
| 申请号 |
WO2016EP54368 |
申请日期 |
2016.03.02 |
| 申请人 |
HENKEL AG & CO. KGAA |
发明人 |
BUTTERBACH, Rüdiger;MARKIEFKA, Patrick;SCHUBERT, Carsten;SIEPENKOTHEN, Judith;KOPANNIA, Siegfried |
| 分类号 |
C09J9/02;H01B1/22 |
主分类号 |
C09J9/02 |
| 代理机构 |
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| 主权项 |
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