| 摘要 |
PURPOSE:To obtain an electrode substrate precisely in a simple process by providing a conductive layer on the entire surface of the substrate including a recess part and resist layer, and by leaving the conductive layer on only the bottom surface of the recess part by removing the conductive layer sticking to the resist layer. CONSTITUTION:On substrate 21 of a glass plate, etc., resist film 22 that corresponds to a no-electrode part pattern is formed in the photoresist method. While resist film 22 is masked, substrate 21 is etched in the plasma method, etc., to form recess part 23 to a required depth, and consequently projection part 24 is formed on substrate 21 under resist film 22. On the entire surface including recess part 23 and resist film 22 on projection part 24, conductive layer 25 made of conductive metal, metallic oxide, etc., is vapor-deposited. Then, resist film on projection part 24 is removed by a solvent treatment, etc. At this time, conductive layers 25 on the top and side surfaces of resist film 22 are removed at a time and the conductive layer remaining in recess part 23 forms electrode layer 26. |
