Low temp. polyurethane adhesive - contg. aq. soln. of urea and sodium sulpho-ricinate

摘要

An adhesive contains (a) 100 mols. of a prepolymer from polydiethylene glycol adipate and toluylene diisocyanate, (b) 5-30 mols. of a polyisocyanate, (c) 1-60 mols. of trichloro- ethyl phosphate, and (d) 0.1-2 mols. of a mixt. of water, urea and Na sulphoricinate in a ratio by wt. of 1:0.01-0.3:0.01-0.2. The compsn. is esp. used to bond heat-insulating blocks, e.g. onto metal substrates. The adhesive can be used at low temp. The bonding strength of the joint is improved. The compsn. has low viscosity and a low content of unconverted, reactive volatiles.