Multi-lead plug-in type package for circuit element.

摘要

In a circuit device, more particularly a plug-in package, comprising a substrate (1) having a die or chip (5) mounted thereon and internal lead patterns or traces (2), the die (5) being connected by wires (6) to the internal lead patterns (2), the die (5) or wires (6) projecting above the highest part of the substrate (1) when the die (5) is mounted on the substrate. The device is characterized by the feature that the substrate (1) is provided with at least one projection (7) which is taller than the die (5) or wires (6). Such projection (7) is formed by an extension of a metal lead (4C) secured to the substrate, the extension (7) projecting above the substtrate (1) at least twice as tall as the tallest part of the wires (6) or die (5), and the extension (7) serves to protect the wires (6) and die (5) when the package is inadvertently toppled or makes contact with another object.