Method for potting and encapsulating electronic circuits

摘要

A method for potting and encapsulating electronic circuits by providing a homogeneous mixture of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125 DEG F. to 212 DEG F., and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns, intermixing the resin-curing agent and microspheres in a ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight, enclosing the electronic circuit with a form, pouring the homogeneous mixture in the form to surround one electronic circuit, and heating the mixture to the required temperature for curing.