发明名称 WIREBONDING METHOD
摘要 PURPOSE:To accomplish an accurate and safe connection of wires by initially connecting the second wire to a conductive film on a substrate by a ball bonding method and then connecting one end of the first wire to the spherical end of the second wire in the ball bonding of the first line. CONSTITUTION:An Au wire 7 is ball bonded to a conductive film 4 of a substrate 1 in such a manner that the spherical end 8 of the wire 7 is positioned at the one end of a wire 6. After the wire 6 is heated compressed on the joint of the spherical end 8, it is ball bonded onto an electrode 2. This stabilizes the ball connection between the wire 6 and the conductive film 4 thereby assuring an accurate bonding.
申请公布号 JPS56126931(A) 申请公布日期 1981.10.05
申请号 JP19800031258 申请日期 1980.03.12
申请人 FUJITSU LTD 发明人 MIYAJIMA EIJI;SHIRAKAWA TATSUO
分类号 H01L21/603;B23K1/00;H01L21/60 主分类号 H01L21/603
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