Electronic component mounting process for PCB - uses metal bridges in contact with metal tracks to permit substrate flexing without damage to solder joints

摘要

An electronic component is mounted on a substrate having different mechanical characteristics by providing printed circuit tracks or metallisation of e.g. copper on the substrate. The component is supported in spaced relationship to the substrate by soldering its connector leads to respective bridges, secured in electrical contact with the copper tracks. The tracks are provided by normal printed circuit methods, and after covering the relevant part of the substrate with resist the bridges are deposited as, e.g. nickel coated chrome and the resist then removed chemically. A globule of paste or the like flexibly supports the middle of the component on the substrate and acts as a heat conductor. The mounting allows flexing and expansion/contraction of the substrate without damaging the component solder joints.