| 摘要 |
<p>The method of forming a connection between conductor strips (2,3) and a semiconductor device (5) such as a transistor, uses thin conductor wires (8) between the strips and the aluminium zones (6,7) forming the base and emitter electrodes. Instead of using gold conductors, a copper-tin, or a copper-tin-lead or a copper-tin-indium alloy is used. The first alloy has a 20 to 60 percent by weight of copper. The second alloy has a 50/40/10 mixture by weight, and the third alloy also has a 50/40/10 mixture.</p> |
