| 摘要 |
This is a method for coating substrates while simultaneously carrying out an ion etching of these substrates. For this purpose, the method is implemented with the aid of a device comprising a hermetically sealed enclosure (1), a vacuum pump (2A), one or two supplies (3,3') for creating a controlled atmosphere, two electrodes (5) and (6) respectively intended to receive the substrates and to constitute the target on the back of which there is an annular permanent magnet (8) forming a flat magnetron together with the electrode (6). This method is applicable in particular for reactive depositions, for depositions on bulk parts as well as for depositions of alloys. <IMAGE>
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