| 摘要 |
<p>PURPOSE:To provide a ceramic package having improved heat dissipation capacity and mechanical strength as well as improved reliability, by forming a substrate on which a semiconductor element or the like is mounted, of a high heat conducting ceramic such as a sintered body of aluminum nitride or silicon carbide, and providing a frame of sintered mullite having metallic conductor wiring therein and bonded to the substrate. CONSTITUTION:A high heat conducting ceramic substrate 10 for a ceramic package is formed of a sintered body of aluminum nitride or silicon carbide. A mullite member 12 to be provided on the top face of the ceramic substrate 10 is bonded to the ceramic substrate 10 with a bonding material interposed therebetween. A predetermined pattern of metallic conductor wiring 14 is provided in the mullite member 12 serving as a frame of the package. An end of an external lead pin 16 is connected to the wiring 14 by brazing them while the other end of the lead pin 16 is projected out of the package. A semiconductor element 18 is secured to the ceramic substrate 10 and a wire 20 is bonded to connect between the element 18 and the conductor wiring 14.</p> |
