发明名称 High pressure plasma deposition of silicon
摘要 Polycrystalline silicon is deposited on the interior surface of a shaped container. The silicon is deposited by reacting hydrogen and a silicon bearing gas in the presence of a high pressure plasma. The silicon body is separated from the shaped container by utilizing thermal expansion shear stress.
申请公布号 US4292342(A) 申请公布日期 1981.09.29
申请号 US19800148095 申请日期 1980.05.09
申请人 MOTOROLA, INC. 发明人 SARMA, KALLURI R.;RICE, JR., M. JOHN;LESK, I. ARNOLD
分类号 C01B33/02;C23C14/22;C23C16/01;C23C16/513 主分类号 C01B33/02
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