发明名称 |
PLANAR BOARD AND CARD-ON-BOARD ELECTRONIC PACKAGE ASSEMBLY |
摘要 |
<p>PLANAR BOARD AND CARD-ON-BOARD ELECTRONIC PACKAGE ASSEMBLY An electronic package assembly having means for providing direct interconnection for one or more planar electronic circuit boards with a nearly conventional card-on-board circuit package. Electrical interconnection between the card-on-board package and the planar boards is accomplished with the use of interposer cards that utilize a pin and spring blade contact system and printed circuitry to connect corresponding pins on the planar boards and the card-on-board package. The mechanical advantage necessary to overcome the spring contact force encountered in insertion and extraction of the planar boards is provided by a unique lever arrangement which latches and unlatches the planar boards.</p> |
申请公布号 |
CA1109953(A) |
申请公布日期 |
1981.09.29 |
申请号 |
CA19780314233 |
申请日期 |
1978.10.25 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FINCH, LARRY R.;ROCHE, JOSEPH D.;ROGERS, PAUL M. |
分类号 |
H05K7/14;(IPC1-7):05K7/10 |
主分类号 |
H05K7/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|