| 摘要 |
PURPOSE:To facilitate a test in a state of wafer, by connecting an IC pad, which has a swell of electric conductive substance, to a testing pad on the surrounding section by a wiring. CONSTITUTION:A testing pad 32 is provided on a surrounding section 31 of an IC30 and connected to a pad, which has a swell of electric conductive substance, by a wiring 33. And therefore, it is possible to execute an inside electrical test without touching the swell 14. After completion of the test, the surrounding section 31 can be cut off and kept in a container if it proved to be necessary to so. |
