| 摘要 |
PURPOSE:To provide a semiconductor device having small size, preferable heat dissipating effect and excellent mechanical strength by forming slits on heat radiating fins and constructing the heat radiator so as to be bonded at a plurality of positions to a mother board. CONSTITUTION:Four packages 2 are bonded via bonding pads 2a onto a mother board 6, and a heat radiator 1 is soldered at the base 10 onto each package 2. In the heat radiator 1 a heat transfer shaft 11 having a diameter D is provided at the center, and square heat dissipating fins 3 formed in thin plate shape are arranged in multiple number in parallel with each other around the shaft 11. Slits 12 are further formed from the lower part to the upper part at the heat transfer shaft 11 and the heat dissipating fins 3. Thus, a semiconductor device having small size, preferable heat dissipating effect and excellent mechanical strength for preventing beforehand a deformation due to thermal stress can be provided. |
