PROCESS AND APPARATUS FOR PREPARATION OF ELECTRONIC COMPONENTS WEB CARRIER

摘要

The present invention provides a process and an apparatus for the preparation of an electronic components web carrier. The process comprises the steps of forming a U-shaped lead wire having a portion of parallel lead wires; feeding a support band of great length continuously; feeding said U-shaped lead wire onto said support band; fixing said U-shaped lead wire firmly to said support band by means of an adhesive tape while controlling the spacing between said parallel lead wires of said U-shaped lead wire; and connecting an electronic component element to the terminals of said parallel lead wires. With this invention, the defects of the prior art, in which there is a low dimensional accuracy in the space between parallel lead wires, can be eliminated and an electronic components web carrier supporting a series of electronic components can be prepared effectively while maintaining a high dimensional accuracy in the space between parallel lead wires.