| 摘要 |
PURPOSE:To increase the number of package pins by mutually bonding with solder, etc. a substrate where a circuit pattern electrically connecting mounted electronic parts is formed and a substrate having lead pins installed in a pierce-through fashion, and thus forming an integrated circuit package. CONSTITUTION:A substrate for chip mounting 7 having a semiconductor chip 3 mounted and a circuit pattern 9 formed, is electrically and mechanically connected on a substrate for package pin installing 8, using a furnace with the help of molten alloy 5 such as solder, etc. In addition, lead pins 2 are installed through in the substrate 8 upright. |
