| 摘要 |
PURPOSE:To facilitate the mounting of semiconductor device, by using lead frames wherein the distances at the root part and at the end part are different and at the end part the parallel part is formed. CONSTITUTION:From one end of a metal band 11 a three-lines set of leads are extended until each lead touches tie bar 13. The central lead 12 a is extended further beyond, while the leads 12b on both sides approach the 12a beyond the bar and become 12b' and are extended parallely with the 12a and have enlarged portions 14a, 14b at the end respectively. Or the bar can be spared. In this case only the leads 12b on both sides are to be approached to the central lead 12a a little before the enlarged end part. With such an arrangement, when the semiconductor is mounted to the printed board, the bend work on the lead is unnecessiated resulting in the easier mounting of the same. |
