发明名称 PREPARATION APPARATUS FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To remove resin varias between the resin part of the base ribbon and the tie bar, by covering the resin varias with a rubber punch with flat end part. CONSTITUTION:A resin seal part 21 is supported by a base table 25, and a lead 24 and a tie bar 23 is supported by a base table 26, and both are set to a mold. A punch consisting of rubber plate 28 with flat surface and greater elasticity and a supporting plate 29 moves up and down by pressing. When the punch 30 descends, first the rubber plate 28 and the part 26 clamp the tie bar 23 and the lead 24, and then the supporting plate 29 descends to start the rubber plate to distort. The resin varias 22, without supports, are destroyed eventually and on the return of the rubber plate to the original position the varias 22' drop. This method is simple and economical, assuring a longer life to the apparatus and repairing works are easily done by only changing the rubber.
申请公布号 JPS56118343(A) 申请公布日期 1981.09.17
申请号 JP19800022132 申请日期 1980.02.22
申请人 发明人
分类号 H01L21/56;(IPC1-7):01L21/56 主分类号 H01L21/56
代理机构 代理人
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