| 摘要 |
PURPOSE:To obtain a small-sized and high-reliability one-dimensional image sensor easily producible, by dividing the paired electrodes opposite to the common electrodes via a photoconductive material layer into groups and then providing the IC chip to be connected to the paired electrodes belonging to each group at a certain side. CONSTITUTION:The common electrode 4, the photoconductive material layer 5 and individual paired electrodes 6 are formed in stripes on the transparent electrode 1a. The electrodes 6 are divided into groups G1-G4... composed of the paired electrodes which are adjacent to each other. Then the IC chip 11 to be connected to each paired electrodes belonging to each group is provided on the substrate 1b of a certain side to the stripe 3 e.g. in such way that the odd-numbered IC chips and the even-numbered IC chips are positioned at the different positions in the widthwise direction of the substrate 1 from each other. In such constitution, the overall structure is made small and at the same time the reliability is increased for a connection between a photodiode element and an IC. |
