| 摘要 |
<p>PURPOSE:To equalize spaces between top and bottom packages at the time of joining of plural packages, by forming a reference level on a semiconductor package for using it as a set-up reference, and also by arranging the packages on top and bottom and connecting them with each other. CONSTITUTION:When a top section 17a... of a lead 17..., which are secured in an concavity 16... which is formed on top surface of a bottom package 20, is used as a reference level and a lead 17', which has a top package 21 having the same leg length, is placed on these surfaces, it becomes possible to decide top and bottom positions of the packages 20 and 21 easily and accurately and therefore it becomes possible to connect the packages to be arranged in vertical direction by soldering, etc. in such a manner as to equalize spaces between the packages. Further, this situation is to remain the same even at the time of using tongue sections 26 and 26' and leads 23 and 23' to be positioned with these tonque sections as the reference levels, and also even if a reference level were to be formed by reducing wall thickness of the bottom-center section of the package.</p> |
