| 摘要 |
An electronic package assembly and a method for making an assembly with an insulator pin carrier (3), a thin (e.g. 5 mu m), flexible printed circuit (PC) member (10) with a polymer, preferably polyimide film (12) having printed circuit conductors (13,14,15) bonded to the heads (5) of the carrier pins (4), and one or more integrated circuit chips (17) with a high density input/output terminal (18) array on the bottom surface bonded to a corresponding registerable array of PC conductor pads (15) on PC member (10). The forming, curing and circuitizing of the PC member (10), the bonding of the terminals (18) to the pads (15), and the bonding of the pin heads(5) to the PC member (10) are done on a temporary support or fixture. |
