| 摘要 |
PURPOSE:To prevent the fluctuation of an element characteristic by arresting a compressive stress and tensile stress against the element by a method wherein a quantity of cover-attached silicon resin covering the top surface of the semiconductor element is made smaller than a volume of the element, in the semiconductor device sealed with the resin. CONSTITUTION:The semiconductor elemenet 13 is fixedly attached on a lead frame 10 having leads 11 by using an adhesive agent 12 composed of a eutectic of gold, solder, and epoxy resin, and electrodes provided on the element are bonded to the leads 11 respectively using wires 14. Then, the silicon resin 15 is cover-attached on the element 13 including the ends of the leads 11 to protect the surface of the element 13. At this time, the resin 15 is cover-attached with the quantity thereof made smaller than the volume of the element 13. Thereafter, the whole including the leads 11 is sealed with resin 16 such as epoxy resin 16 to form the resin sealed semiconductor device 17. Whereby the compressive stress and contraction stress are balanced between the front face and the rear face of the frame 10 and the element 13 is not transformed. |
