| 摘要 |
PURPOSE:To obtain a supporting electrode having high conductivity, low thermal resistance and a low thermal expansion coefficient by laminating Cu or Al to a Cu-C filber compound body. CONSTITUTION:A composite fiber bundle of Cu-C with about 8mum diameter, plated with Cu with 1mum thickness is spirally wound, and temporarily sintered in the H2 at 350 deg.C. A Cu plate with the same diameter is stacked, and the whole is set into a graphite case, and pressed by the force of 1 ton in the H2 at 850 deg.C. In the molded electrode, a supporting electrode with the desired dimensions is cut out using the fiber compound body side as the reference. In this case, the texture of the C fibers are not disordered at all, and unified with the Cu plate. According to such constitution, the excellent semiconductor supporting electrode is obtained at high yield. |
