发明名称 Method for producing a metallic pattern upon a substrate
摘要 A metallic foil is laminated to a transparent substrate with a photopolymerizable adhesive. An outer layer of photoresist is used in etching a pattern in the foil. The etched foil itself is then used as a resist in the complete removal of the uncovered portions of the adhesive, leaving the transparency of the revealed substrate material totally unimpaired. Finally, the remaining adhesive is hardened by polymerization resulting from exposure to ultraviolet light passed through the substrate from the unlaminated side.
申请公布号 US4288282(A) 申请公布日期 1981.09.08
申请号 US19790079865 申请日期 1979.09.28
申请人 HEWLETT-PACKARD COMPANY 发明人 BROWN, LAWRENCE E.;BAUER, JAMES L.;SCHECK, GERALD W.
分类号 B60S1/02;C23F1/02;G01B11/00;G01B11/03;G03F7/00;H05K1/16;H05K3/00;H05K3/06;H05K3/38;(IPC1-7):B44C1/22;H01L21/31 主分类号 B60S1/02
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