| 摘要 |
PURPOSE:To bond lead wires stably and in excellent productivity by a method wherein a bonding section is mechanically fixed by means of a tool having a fixed temperature, the tool or the tool and the lead wires are heated in pulsating manner and then the tool is separated. CONSTITUTION:A solder film is formed on a metallic film 2a on a glass plate 1, a lead wire 3a plated with solder is stacked thereon, the lead wire is pushed by means of a bonding tool 40 and the location is fixed. The tool 40 is heated at or below the melting point of solder by conducting a coil 6. Pulsating currents are flowed, the tool 40 is heated in a pulsating manner, the solder coating is melted, a bonding section 5 is made up and the tool 40 is separated. According to such constituion, the bonding sections are mechanically stable and the leads are not short-circuitted with adjacent leads because the lead wires are fixed at the fixed locations of the metallic films by means of the tool, and the bonding sections are quickly heated and cooled and the productivity is excellent because the tool is heated in a pulsating manner. |
