| 摘要 |
A poly(oxypropylene) diamine (I) was treated with urea, PhNCO, HCO2H, or BzOH to prep. poly(oxypropylene)diureides or diamides which were used as additives to improve the thermal shock resistance of epoxy resins hardened with methyl-5-norbornene-2,3-dicarboxylic anhydride. Thus, 1980g I (mol. wt. 2000, 1.01 mequiv. HN2/g) and 180g urea were heated at 130oC-134≦̸C for 2 hr, treated with 990 g I during 3hr at 132oC, and heated at 134oC for 70min to prep. a diurea.
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