| 摘要 |
<p>PURPOSE:To obtain the high molecular piezoelectric body having large thickness piezoelectricity by prescribing processing temperature by using a copolymer of vinylidene fluoride and ethylene trifluoride, whose mol% is prescribed respectively, and thereby increasing an electromechanical connection coefficient. CONSTITUTION:The high molecular piezoelectric body is prepared by using the copolymer of vinylidene fluoride of 65-95mol% and ethylene trifluoride of 35- 5mol% or a polymer composition whose main constituents are these materials. At this time, the value of the electromechanical connection coefficient of the polymer is first prescribed to be 0.05 or more, while the processing temperature is also prescribed to be [crystal dislocation temperature -5 deg.C]-[melting-point temperature]. Next, poling processing is applied for one hour under the condition that the temperature is prescribed to be 80-140 deg.C and that poling voltage to be 200- 300kV/cm. In this way, the value of the connection coefficient is increased to around 0.3 through the poling processing the thus the large thickness piezoelectricity can be obtained.</p> |
