| 摘要 |
PURPOSE:To obtain a surer resin seal, by hardening while maintaining the hardening temperature at which the seal has been made after the resin seal of a semiconductor device is conducted. CONSTITUTION:A semiconductor pellet 12 and a lead frame 13 is sealed by resin 14 at a relatively high temperature (170 deg.C for instance) using a mold 11. Then the same is kept in a heat block 15 for maintaining the temperature so that the subsequent hardening treatment is performed at approximately the same temperature (170 deg.C) as that at which the seal has been made. Therefore the frame 13 and the resin 14 are adhered to each other so closely that no moisture can penetrate through the interface. |
