HEAT TRANSFER CONNECTION IN A COOLING MODULE

摘要

Heat transfer connection in a cooling module wherein at least one semiconductor chip (10) to be cooled is supported on a substrate (12) portion of the module. The provision of thin leaf or rectangularly shaped members (21) each having a relatively long thin planar surface in thermal contact with a planar surface of the chip (10) to be cooled, said thin leaf shaped members (12) each being contained within a discrete narrow, relatively deep slot (20, 20A) within a module cover (16), each of said thin leaf shaped members (21) being spring (22) biased in thermal contact with said planar surface of said chip (10), whereby the relatively long thin planar surface of each thin leaf shaped member (21) is maintained in intimate thermal contact with the planar surface of the chip (10).