| 摘要 |
PURPOSE:To enable mass processing without quality degradation by floating a resin film oozing out onto a lead in an unsealed part at time of molding with the use of an electrolytic solution and removing the said floated resin through the blowing of a compressed air. CONSTITUTION:A semiconductor device whose resin sealing is completed is immersed in an electrolytic bath filled with a weak alkali or a weak acid electrolytic solution 7 and a burn 3 attaching on a lead 1 is caused to float through electrolytic process. Next, this floated burr 3 is blown off by a compressed air 9 from a nozzle 8. In this manner, it is possible to remove burr with ease and on a larger treatment basis without generation of cracks on a sealing resin 2 and also injuring the lead. |
