| 摘要 |
PURPOSE:To improve reliability of a connection part by piercing a hole for leadless package on a circuit substrate and connecting a substrate with a package with a circuit foil of such shape as to absorb heat stress. CONSTITUTION:A hole 5 slightly larger the size of leadless package 1 is provided on a resin laminated substrate 2 containing base materials such as paper, glass, etc. In this hole 5, a leadless package 1 is fitted and a pad 4 of package 1 and a substrate 2 are connected together with a connection circuit foil 6. The connection circuit foil 6 is partially bent like an arc or slightly bent upward. By fabricating it in this way, heat expansion stress at time of soldering can be absorbed by the shape of the foil 6. This connection part can be checked with the eye, so that the connection can be confirmed or corrected easily. |
