PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD THEREOF

摘要

PURPOSE:To make possible an automatic wire bonding by forming a position identification pad at least on two spots on the surface of a printed circuit board and correcting a position for the board and a pellet. CONSTITUTION:A concave is formed on a printed circuit board 10 and a pellet 13 is adhered in this concave 11. Around the concave 11, alead 12a for connecting a wire 15 with an electrode pad 14 is arranged. At least two spots near the lead 12a, a position identification pad 17 is formed. After a position detection device 21 consisting of a combination of TV camera 19 and a computer 20 worked to detect the relative position relationship between the pellet 1 and the board, the position relation is corrected according to the memory of the computer and then an automatic wire bonder 22 is actuated. In this manner, automatic operation is possible without the necessity of positioning through a visual check by an operator.