FORFARANDE FOR UPPLINJERING AV ETT MONSTER INNEFATTANDE EXPONERING AV ETT NEGATIVT RESISTMATERIAL

摘要

1484873 Electron sensitive processes WESTERN ELECTRIC CO Inc 23 Oct 1974 [23 Oct 1973] 45812/74 Headings G2C and G2X A process for producing negative resists comprises (1) imagewise exposing to electron beams or x-rays a material comprising a support and a layer of an uncured polymer which contains an ethylenically unsaturated main chain with branches of aliphatic groups at least some of which contain cross-linkable epoxy groups connected to the main chain through at least one atom and there being at least one epoxy group per 5 monomer units; the weight average molecular weight (M n ) being 103 to 106 and the ratio M w :M n is less than 5, M n being the number average molecular weight; the lower temperature limit of the glass transition temperature range (Tg) being below the lowest temperature of the material before exposure, and (2) removing the unexposed and uncross-linked areas with a developer. Specified polymers are poly'glycidyl acrylate, glycidyl methacrylate/ethyl acrylate copolymers and polymers which contain vinyl ferrocene which acts as an x-ray absorber, the polymers preferably having a Tg below 22‹C. Polyglycidylmethacrylate (Tg = 46‹C) is stated to be unevitable. The developed resist may be post baked for 5-30 minutes at 60-130‹C to increase cross-linking. The resist may be stripped off the support by hot (50‹C) chromic acid solution or by an oxygen plasma at 300w., 25 milltorr. pressure.