| 摘要 |
PURPOSE:To improve the activity rate and yield of an assembling apparatus for a semiconductor by constituting a cooling portion by the upper and lower blocks in each of which a refrigerant passage where a cooling gas circulates is provided, filling the cooling portion with an inert gas and soldering pellets with high accuracy as well as cooling them in a short period of time. CONSTITUTION:Blocks 2 and 3 are heated by heaters 11 and 24, and N2 is introduced 6 and 20 into a space 38 formed by the blocks 2 and 3 and rails 1. The main body 17 of the block 3 is driven in a given course. When ascending, the body 17 is positioned by pins and holes, and semiconductor pellets are supplied and highly accurately and speedily bonded on the stem through the solder having fused without being oxidized. Subsequently, the stem is sent to the cooling portion and moved in a tunnel 57 under a block 50 by a block 51 driven in a given course. During this, N2 is supplied 54 into the tunnel as well as cooling gases are supplied 54 and 66 and discharged through gaps between fins 62 and 68 in order to cool the pellets in a short period of time. By said constitution, pellets can be successively bonded onto a stem. |
