发明名称 RESIN SEALING METHOD FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent short circuit of a wire due to thermal distortion of a tab lead by a method wherein a coupling zone of a frame in one piece of tab lead and the tab lead is branched, and said part is enclosed in a resin. CONSTITUTION:A semiconductor element 6 is connected to an outgoing lead 4 of a lead frame 2 with a connector wire 7. Then, tab leads 8, 8' are coupled to the frame 2 to hold a tab 5. Further, a through hole 9 to absorb distortion is provided on one coupling zone of the tab leads 8, 8'. Where the tab and the tab lead expand thermally for a difference in temperature arising between the tab 5, tab lead 8 and the other parts, the coupling zone is deformed as indicated by broken line to absorb distortion, thus preventing a short circuit fault.
申请公布号 JPS56107568(A) 申请公布日期 1981.08.26
申请号 JP19800169610 申请日期 1980.12.03
申请人 HITACHI LTD 发明人 OGURA SADAO;HOUYA KAZUO
分类号 H01L23/50;H01L21/56;H01L21/60;H01L23/28;H01L23/495 主分类号 H01L23/50
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