| 摘要 |
PURPOSE:To automate a die bonder full by detecting an operating condition of a collet cylinder at a given timing. CONSTITUTION:A die bond arm moving between a chip support 2 and a material to bond 3 as indicated by arrow is provided on a die bonder. A cylindrical collet to adsrob a chip 1 and carry it onto a conductive adhesive on the material to bond 3 is provided at the tip of said arm. An opening state of the collet tip is detected at a point S1 where a die bond starts for bonding, a point S2 where the collet finishes an operation to adsorb the chip 1 on the support 2, and a point S3 where the chip 1 is bonded on the material 3 and thus the adsorption operation is cleared. Since measures coping with troubles at each point can be taken pertinently according to the above constitution, the die bonder can be automated full. |
