| 摘要 |
PURPOSE: To prevent metal leads of a tape carrier from being cut or torn off from the metal pattern on the printed circuit board even if the tape carrier is bent by forming cuts on both sides of the outer part of the leads to absorb stress with own distortion. CONSTITUTION: Outer leads 12 of the tape carrier 10 are bonded to the metal pattern formed on a substrate 23 and the semiconductor device 11 is covered totally by resin 22 as potting method to form an IC module 20. The cuts 16a, 16b, 16c, formed on the part 12a of the metal lead 14 absorb the stress of the lead 14 by stretching the part 12a when the lead 14 is pulled. Then, the outer lead 12 is not cut or torn off from the metal pattern 21 on the printed circuit board even if the metal lead 14 is pulled. |
