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发明名称
METHOD OF SEALING ELECTRONIC PART
摘要
申请公布号
JPS56106321(A)
申请公布日期
1981.08.24
申请号
JP19800008054
申请日期
1980.01.25
申请人
OMRON TATEISI ELECTRONICS CO
发明人
KITAGAWA TAKUJI
分类号
H01C1/02;H01C1/04;H01F7/08;H01H50/02;H01H51/29
主分类号
H01C1/02
代理机构
代理人
主权项
地址
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