| 摘要 |
PURPOSE:To enable a mounting in high density to be preclised by a method wherein steps are formed on an external side wall of a layer-built chip-carrier type container composed of a metallized layer mounted on a ceramic plate, and an external electrode is arranged. CONSTITUTION:Ceramic frames 11b, 12b are piled on a ceramic substrate 1b to form the steps, and the metallized layers of W are formed on a junction pad 5b, an attaching means 3b of IC chip 2, from the pade 5b to the external electrode 8 through the ceramic layer-built 7b and further, a fitting means of a sealing ring 6b. A heatsink 13b is fitted on the reverse of a package as required. The chip 2b is applied a wiring 4b and hermetically sealed with a cap 9b. Moreover, a circuit substrate 14b is fitted with the package using the external terminal 8b. In the event, with a gap between a fitting hole and the external diameter made of the order of 0.2mm., the position fitting for soldering is made easily. The device allowing the epoxy glass and polyamide resin to be used on the substrate 14b, being low in the heat resistance and having the high density mounting in high reliability can be obtained. |
